| Quartz | Continuous use commonly around 900–1,100 °C, depending on design and thermal cycling. | Excellent resistance to most wet-process chemicals; suitable for high-temperature oxidation and diffusion environments. | Typically 25–100 wafers per cassette, depending on wafer size, slot pitch, and process equipment. | ★★★★★ Very low metal contamination when properly cleaned and handled. | Rigid construction, precise wafer slots, compatible with automated transfer systems; requires careful handling to avoid chipping or breakage. | High-temperature stability, good chemical resistance, and low contamination risk. | High purchase cost; brittle; heavier than many polymer alternatives; can develop micro-cracks after repeated thermal cycling. | High-temperature diffusion, oxidation, annealing, and other furnace processes. |
| PFA or PTFE | Typical continuous service range is approximately 150–260 °C, depending on grade, load, and mechanical design. | Excellent resistance to acids, bases, and many solvents used in wet processing. | Typically 25–100 wafers per cassette; capacity depends strongly on wall thickness and slot spacing. | ★★★★★ Low particle generation and low risk of metallic contamination when maintained correctly. | Lightweight, corrosion-resistant, and suitable for manual or robotic handling; polymer slots can reduce wafer edge damage. | Excellent chemical resistance, low weight, and strong protection against many wet-process chemicals. | Lower stiffness than quartz or metal; may deform under excessive heat or mechanical load; relatively high material cost. | Acid cleaning, texturing, etching, rinsing, and other aggressive wet-chemical steps. |
| Polypropylene (PP) | Commonly used up to approximately 80–100 °C in wet-process applications, subject to load and exposure time. | Good resistance to many acids, alkalis, and aqueous solutions; compatibility should be verified for strong oxidizers and solvents. | Typically 25–100 wafers per cassette; high-density configurations are available for standard wafer sizes. | ★★★★☆ Low particle risk when molded, cleaned, and dried correctly. | Lightweight, economical, easy to handle, and commonly available with standardized robotic interfaces. | Low cost, low weight, good chemical resistance, and practical for high-volume wet handling. | Not suitable for high-temperature furnace processes; can warp, embrittle, or absorb process residues over time. | Room-temperature or moderate-temperature cleaning, rinsing, texturing, and chemical transfer. |
| PEEK | Typical continuous service range can reach approximately 250–260 °C, depending on grade and mechanical stress. | Very good resistance to many acids, bases, hydrocarbons, and solvents; chemical validation is still required for specific recipes. | Typically 25–100 wafers per cassette; commonly selected when dimensional stability is important. | ★★★★★ Low outgassing and good dimensional stability for demanding processes. | Lightweight and rigid compared with many other polymers; supports precise slot alignment and repeated handling. | High mechanical strength, good thermal stability, and strong chemical resistance. | Higher cost than PP; some aggressive chemicals and high-temperature conditions may still require testing. | Higher-temperature wet processing, specialty cleaning, and applications requiring tight dimensional control. |
| PVDF | Typical continuous service range is approximately 120–150 °C, depending on grade and design. | Very good resistance to many acids, halogens, and oxidizing chemicals used in semiconductor and solar processing. | Typically 25–100 wafers per cassette, with capacity determined by wafer diameter and slot pitch. | ★★★★☆ Low contamination potential when properly cleaned and dried. | Lightweight, corrosion-resistant, and suitable for wet benches and manual or automated transfer. | Strong chemical resistance with better temperature capability than many commodity polymers. | More expensive than PP; may be less rigid than quartz or metal and requires process-specific compatibility checks. | Oxidizing wet chemistry, acid cleaning, rinsing, and moderate-temperature chemical processing. |
| Stainless Steel | Often suitable for elevated-temperature handling; practical limits depend on alloy, surface finish, and process atmosphere. | Good general durability, but exposure to chlorides, strong acids, or oxidizers can cause corrosion or metal-ion release without suitable protection. | Typically 25–100 wafers per cassette; custom high-capacity frames are possible. | ★★★☆☆ Requires electropolishing, passivation, or protective coating to reduce contamination risk. | High rigidity, durable frame, and excellent resistance to mechanical impact; heavier for operators and robots. | Strong, durable, and suitable for repeated mechanical handling and selected high-temperature applications. | Potential metal contamination, higher weight, and possible corrosion in aggressive wet chemistry. | Mechanical transport, selected high-temperature steps, and processes where structural rigidity is prioritized. |
| Quartz-Coated or Polymer-Coated Metal | Temperature capability depends on the coating system and substrate; verify the rated operating and thermal-cycling limits. | Can provide improved chemical resistance compared with bare metal, but scratches, pinholes, or coating wear may expose the substrate. | Typically 25–100 wafers per cassette, with custom capacities available. | ★★★★☆ Performance depends heavily on coating integrity, cleaning method, and service life. | Combines a rigid metal structure with a lower-contact-contamination surface; requires inspection before use. | Good mechanical strength with improved surface protection and process flexibility. | Coating damage can create contamination, wafer scratches, or corrosion sites; maintenance is more demanding. | Specialized handling systems requiring rigidity with improved chemical or contamination control. |