| 30–50 GHz | 10–6 mm | Lower millimeter-wave frequencies; portions of the Ka band | Satellite communications, high-capacity point-to-point links, and scientific instrumentation | Gain, output power, and noise performance must be balanced against transmission-line and component losses. |
| 50–75 GHz | 6–4 mm | V band; 57–71 GHz is used for unlicensed-device applications in some regions | Short-range multi-gigabit wireless links, data-center links, and radar research | Atmospheric absorption is relatively strong near 60 GHz, so link distance and local regulations matter. |
| 75–110 GHz | 4–2.73 mm | W band; E-band links include 71–76 GHz and 81–86 GHz | Fixed wireless backhaul, automotive radar around 76–81 GHz, and imaging systems | Low-loss packaging, antenna integration, and thermal management become increasingly important. |
| 110–170 GHz | 2.73–1.76 mm | D band includes 110–170 GHz in common band nomenclature | Experimental high-capacity communications, spectroscopy, and passive or active imaging | Small circuit dimensions and connector or waveguide transitions require precise fabrication and calibration. |
| 170–220 GHz | 1.76–1.36 mm | Submillimeter-wave region | Laboratory spectroscopy, atmospheric research, and specialized imaging | Available output power is often limited; measurement fixtures and interconnect losses can strongly affect results. |
| 220–300 GHz | 1.36–1 mm | Upper millimeter-wave and submillimeter-wave region | Research communications, material analysis, and high-resolution sensing | Very high-frequency operation places demanding requirements on device technology, packaging, and measurement equipment. |
| Amplifier gain | Reported in decibels (dB) | Small-signal gain describes amplification under specified test conditions | Used to determine how much a receiver or transmitter signal level is increased | Gain varies with frequency, bias, temperature, and input power; a single value does not describe the full band. |
| Noise figure | Reported in decibels (dB) | Describes degradation of signal-to-noise ratio by an amplifier | Especially important for low-noise amplifiers at the front end of receivers | Lower noise figure is generally desirable in a receiver, while output power and linearity may be priorities in a transmitter. |
| Output power and linearity | Power commonly reported in dBm or watts | Output compression and intermodulation are standard performance considerations | Determine usable transmit power and the ability to amplify modulated signals cleanly | Higher output power can increase heat and distortion; the suitable operating point depends on the signal and system. |
| Common semiconductor technologies | Technology choice depends on frequency and application | Examples include GaAs pHEMT, InP HEMT, GaN HEMT, and SiGe BiCMOS | Used in different combinations for low-noise, high-frequency, high-power, or integrated circuits | No single technology is best for every design; frequency, power, noise, efficiency, cost, and integration needs guide selection. |